Invention Application
- Patent Title: PHYSICAL QUANTITY SENSOR AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 物理量传感器及其制造方法
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Application No.: US15022954Application Date: 2014-09-23
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Publication No.: US20160223582A1Publication Date: 2016-08-04
- Inventor: Minekazu SAKAI , Kiyomasa SUGIMOTO
- Applicant: DENSO CORPORATION
- Priority: JP2013-200068 20130926
- International Application: PCT/JP2014/004859 WO 20140923
- Main IPC: G01P15/125
- IPC: G01P15/125 ; H01L29/84 ; H01L29/66
Abstract:
In a physical quantity sensor, a contact part that is directly and electrically connected to an external circuit is formed in a support substrate, and the support substrate is maintained at a predetermined potential through the contact part. With this configuration, the support substrate is maintained at the predetermined potential without disposing an electrode in the interior of the semiconductor layer. For that reason, a processing precision can be restrained from being reduced in forming the movable electrode, and hence a detection precision can be restrained from being reduced.
Public/Granted literature
- US10338092B2 Physical quantity sensor and method for manufacturing the same Public/Granted day:2019-07-02
Information query
IPC分类:
