Invention Application
- Patent Title: SUBSTRATE LIFT ASSEMBLIES
- Patent Title (中): 基座提升组件
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Application No.: US15139274Application Date: 2016-04-26
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Publication No.: US20160240410A1Publication Date: 2016-08-18
- Inventor: Paul B. Reuter , Ganesh Balasubramanian , JuanCarlos Rocha-Alvarez , Jeffrey B. Robinson , Dale Robert du Bois , Paul Connors
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/677
Abstract:
A substrate lift assembly is disclosed. The substrate lift assembly includes a lift frame, a plurality of fingers extending from the frame, the fingers adapted to support a substrate, and a containment ring supported by the lift frame. Process load locks including the substrate lift assembly are disclosed, as are other aspects.
Information query
IPC分类:
