There is disclosed a plating apparatus which can dispose an anode, a substrate and a regulation plate parallel to each other in such a manner that the center of the anode, the center of the substrate and the center of an opening of the regulation plate are aligned in a straight line. A frame of the plating apparatus includes: a support for supporting upper portions of an anode holder, a substrate holder and the regulation plate; a box structure secured to the support; an upper positioning structure for fixing a relative position between the support and the upper portions of the anode holder, the substrate holder and the regulation plate; and a lower positioning structure for fixing a relative position between the box structure and lower portions of the anode holder, the substrate holder and the regulation plate.