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公开(公告)号：US20150247253A1
公开(公告)日：2015-09-03
申请号：US14634647
申请日：2015-02-27
申请人： EBARA CORPORATION
CPC分类号： C25D17/06 , C25D17/001 , C25D17/005
摘要： A substrate holder according to the present invention comprises a first power supply member and a second power supply member which allow power to be supplied to substrates having different properties. The first power supply member comprises a first power supply member end part which extends toward the inside of a substrate holding surface and is disposed at a first position of the substrate holding surface. The second power supply member comprises a second power supply member end part which extends toward the inside of the substrate holding surface and is disposed at a second position of the substrate holding surface. The first position is located on the center side of the substrate holding surface relative to the second position.
摘要翻译： 根据本发明的衬底保持器包括第一电源构件和第二电源构件，其允许向不同性质的衬底供电。 第一供电构件包括朝向衬底保持表面的内部延伸并且设置在衬底保持表面的第一位置处的第一电源构件端部。 第二电源构件包括朝向衬底保持表面的内部延伸并且设置在衬底保持表面的第二位置处的第二电源构件端部。 第一位置相对于第二位置位于基板保持表面的中心侧。
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公开(公告)号：US20160258080A1
公开(公告)日：2016-09-08
申请号：US15058108
申请日：2016-03-01
申请人： EBARA CORPORATION
发明人： Masaaki KIMURA , Mitsutoshi YAHAGI
CPC分类号： C25D17/08 , C25D17/001 , C25D17/007 , C25D17/008 , C25D17/02 , C25D17/06 , C25D17/12
摘要： There is disclosed a plating apparatus which can dispose an anode, a substrate and a regulation plate parallel to each other in such a manner that the center of the anode, the center of the substrate and the center of an opening of the regulation plate are aligned in a straight line. A frame of the plating apparatus includes: a support for supporting upper portions of an anode holder, a substrate holder and the regulation plate; a box structure secured to the support; an upper positioning structure for fixing a relative position between the support and the upper portions of the anode holder, the substrate holder and the regulation plate; and a lower positioning structure for fixing a relative position between the box structure and lower portions of the anode holder, the substrate holder and the regulation plate.
摘要翻译： 公开了一种电镀设备，其可以将阳极，基板和调节板以彼此平行的方式布置，使得阳极的中心，基板的中心和调节板的开口的中心对准 在一条直线上。 电镀装置的框架包括：用于支撑阳极保持件的上部的支撑件，基板保持件和调节板; 固定在支架上的盒子结构; 用于固定所述支撑件和所述阳极保持件，所述基板保持件和所述调节板的上部之间的相对位置的上定位结构; 以及用于固定盒结构和阳极保持器，基板保持器和调节板的下部之间的相对位置的下定位结构。
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公开(公告)号：US20150275390A1
公开(公告)日：2015-10-01
申请号：US14629453
申请日：2015-02-23
申请人： EBARA CORPORATION
CPC分类号： C25D17/12 , C25D17/001 , C25D17/007
摘要： An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.
摘要翻译： 公开了能够在基板上形成均匀厚度的金属膜的阳极单元。 阳极单元包括阳极，连接到阳极的中心部分的第一馈电部分，位于阳极的中心轴线上并且远离阳极定位的第二馈电部分以及从第二馈电部分径向延伸的臂。 臂连接到阳极的周边。
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公开(公告)号：US20190249326A1
公开(公告)日：2019-08-15
申请号：US16396384
申请日：2019-04-26
申请人： EBARA CORPORATION
发明人： Junko MINE , Tsutomu NAKADA , Mitsutoshi YAHAGI
摘要： In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.
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公开(公告)号：US20160369421A1
公开(公告)日：2016-12-22
申请号：US15118036
申请日：2015-02-05
申请人： EBARA CORPORATION
CPC分类号： C25D17/10 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/04 , C25D17/06
摘要： To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space.An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.
摘要翻译： 根据本发明的阳极保持器60包括：内部容纳阳极的内部空间61; 隔膜，其构造成覆盖所述内部空间61的前表面; 孔71，形成在阳极保持件的外表面上并与内部空间61连通; 以及密封孔71关闭的阀91。
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公开(公告)号：US20160108539A1
公开(公告)日：2016-04-21
申请号：US14882671
申请日：2015-10-14
申请人： EBARA CORPORATION
发明人： Mitsutoshi YAHAGI , Masaaki KIMURA , Yusuke TAMARI
IPC分类号： C25D17/00 , H01L21/687 , H01L21/673
CPC分类号： C25D17/004 , C25D7/12 , C25D17/001 , C25D17/06 , H01L21/67126 , H01L21/68721 , H01L21/68728
摘要： A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.
摘要翻译： 公开了用于保持诸如晶片的衬底的衬底保持器。 衬底保持器包括能够与衬底的周边部分接触的密封环，支撑密封环的支撑环和将密封环压靠支撑环的固定环。 固定环包括具有内圆周表面和外圆周表面的环形部分，每个表面由锥形表面构成。 固定环还包括连接到环形部分的密封环按压部分和从密封环按压部分径向向内突出的调节环。 调节环的内径小于密封环的内径。
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公开(公告)号：US20140360865A1
公开(公告)日：2014-12-11
申请号：US14296366
申请日：2014-06-04
申请人： EBARA CORPORATION
CPC分类号： C25D17/12 , C25D3/38 , C25D17/001 , C25D17/002 , C25D17/008 , C25D17/10 , C25D21/10
摘要： A copper electroplating apparatus is disclosed. The copper electroplating apparatus includes: a plating bath configured to hold a plating solution therein; a soluble anode of phosphorus-containing copper; a substrate holder configured to hold a substrate; an anode bag that surrounds the anode, the anode bag being formed of mesh; a regulation plate configured to regulate an electric field, the regulation plate having an opening and being disposed between the anode and the substrate held by the substrate holder; and a diaphragm disposed so as to dose the opening of the regulation plate, the diaphragm being configured to allow permeation of metal ions therethrough and not allow permeation of additives contained in the plating solution.
摘要翻译： 公开了一种铜电镀装置。 铜电镀装置包括：电镀液，其被配置为在其中保持电镀液; 含磷铜的可溶性阳极; 衬底保持器，其构造成保持衬底; 阳极袋围绕阳极，阳极袋由网状物形成; 配置为调节电场的调节板，所述调节板具有开口并且设置在所述阳极和由所述衬底保持器保持的所述衬底之间; 以及设置成对调节板的开口施加剂量的隔膜，所述隔膜被构造成允许金属离子渗透，并且不允许包含在电镀溶液中的添加剂渗透。
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公开(公告)号：US20220379352A1
公开(公告)日：2022-12-01
申请号：US17839070
申请日：2022-06-13
申请人： EBARA CORPORATION
发明人： Masaya SEKI , Mitsutoshi YAHAGI , Nobuya YAMADA
摘要： A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.
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公开(公告)号：US20190219627A1
公开(公告)日：2019-07-18
申请号：US16245154
申请日：2019-01-10
申请人： EBARA CORPORATION
摘要： A current measuring module for measuring a current flowing through the substrate holder using an inspection substrate is provided. The substrate holder includes a plurality of holder electric contacts. The plurality of holder electric contacts contact a substrate to supply the held substrate with a current. The substrate holder holds the inspection substrate for measuring the current flowing through the substrate holder. The plurality of holder electric contacts contact a plurality of respective independent substrate electric contacts disposed on the inspection substrate. The inspection substrate includes a plurality of measurement points connected to the plurality of respective substrate electric contacts with wirings and substrate side connectors electrically connected to the plurality of measurement points. The current measuring module includes a plurality of inspection probes configured to contact the plurality of respective measurement points on the inspection substrate.
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10.发明申请公开(公告)号：US20180135198A1
公开(公告)日：2018-05-17
申请号：US15808466
申请日：2017-11-09
申请人： EBARA CORPORATION
IPC分类号： C25D17/06 , C25D7/12 , G01M3/32 , H01L21/687 , H01L21/288
CPC分类号： C25D17/06 , C25D5/34 , C25D7/12 , C25D17/001 , C25D17/004 , C25D17/02 , C25D21/04 , C25D21/06 , C25D21/10 , C25D21/12 , G01M3/3209 , G01M3/3263 , G01M3/3281 , H01L21/2885 , H01L21/67126 , H01L21/68721
摘要： There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.
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