Invention Application
- Patent Title: CIRCUIT ELEMENT PACKAGE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING APPARATUS THEREOF
- Patent Title (中): 电路元件封装及其制造方法及其制造方法
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Application No.: US15061233Application Date: 2016-03-04
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Publication No.: US20160262292A1Publication Date: 2016-09-08
- Inventor: Keon KUK , Young-dae KO , O-hyun BEAK , Eun-bong HAN , Hyeon-hyang KIM , Yeon-kyoung JUNG , Il-ju MUN
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0162318 20151119
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K3/30 ; H05K3/10 ; B05B15/00 ; H01L23/498 ; H01L23/31 ; H01L23/29 ; H01L21/56 ; H01L21/3205 ; H05K1/18 ; H01L23/552
Abstract:
A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
Public/Granted literature
- US10566293B2 Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof Public/Granted day:2020-02-18
Information query
