公开(公告)号：US20170057161A1

公开(公告)日：2017-03-02

申请号：US15229981

申请日：2016-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon KUK ,  Eun-bong HAN ,  Young-dae KO ,  Hyeon-hyang KIM ,  O-hyun BEAK ,  Jun-hee LEE ,  Yeon-kyoung JUNG

IPC: B29C67/00 ,  B33Y70/00 ,  B33Y50/02 ,  B33Y30/00 ,  B33Y10/00

CPC classification number: B29C67/0059 ,  B29C64/112 ,  B29C64/386 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Abstract translation: 提供了一种物体形成装置及其控制方法。 物体形成装置包括：喷射器，被配置为基于物体数据喷射物体形成材料;通过堆叠注射物体形成材料形成物体的基部;被配置为检测堆叠在物体上的物体的高度的传感器 基部和控制器，被配置为基于从传感器输出的信号来控制喷射器。

公开(公告)号：US20180204783A1

公开(公告)日：2018-07-19

申请号：US15840326

申请日：2017-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-bong HAN ,  Hyeon-hyang KIM

IPC: H01L23/427 ,  H05K9/00 ,  H05K7/20 ,  G06F1/20 ,  H01L23/552 ,  H01L23/367 ,  F28D15/02 ,  H05K1/02

CPC classification number: H01L23/427 ,  F28D15/0233 ,  G06F1/203 ,  H01L23/3675 ,  H01L23/552 ,  H04M1/0202 ,  H05K1/0216 ,  H05K1/0218 ,  H05K3/284 ,  H05K7/20336 ,  H05K7/2099 ,  H05K9/003 ,  H05K9/0088 ,  H05K2201/0367 ,  H05K2201/064

Abstract: An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

公开(公告)号：US20160262292A1

公开(公告)日：2016-09-08

申请号：US15061233

申请日：2016-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon KUK ,  Young-dae KO ,  O-hyun BEAK ,  Eun-bong HAN ,  Hyeon-hyang KIM ,  Yeon-kyoung JUNG ,  Il-ju MUN

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/10 ,  B05B15/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/3205 ,  H05K1/18 ,  H01L23/552

CPC classification number: B05B15/20 ,  H01L23/24 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/0126 ,  H05K2203/1316 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Abstract translation: 提供电路元件封装，其制造方法及其制造装置。 电路元件封装包括布置在印刷电路板上的电路元件，覆盖电路元件的绝缘层，覆盖绝缘层侧表面的第一屏蔽层和覆盖绝缘层上表面的第二屏蔽层，以及 电连接到第一屏蔽层。