Invention Application
- Patent Title: COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 复合焊球，使用其的半导体封装，使用其的半导体器件及其制造方法
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Application No.: US14918698Application Date: 2015-10-21
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Publication No.: US20160263709A1Publication Date: 2016-09-15
- Inventor: Tao Cheng , Wen-Sung Hsu , Shih-Chin Lin
- Applicant: MEDIATEK Inc.
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K35/26 ; B23K35/30 ; H01L23/00
Abstract:
A semiconductor package includes a first substrate, a second substrate, a composite solder ball and a first semiconductor component. The composite solder ball includes a core, an encapsulating layer and a barrier layer. The composite solder ball is disposed between the first substrate and the second substrate for electrically connecting the first substrate and the second substrate. The barrier layer is disposed between the core and the encapsulating layer. Wherein a melting point of the barrier layer is higher than a melting point of the core, the melting point of the core is higher than a melting point of the encapsulating layer. The first semiconductor component is disposed between the first substrate and the second substrate.
Public/Granted literature
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