Invention Application
- Patent Title: Low Profile Multi-Anode Assembly
- Patent Title (中): 薄型多阳极装配
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Application No.: US14657194Application Date: 2015-03-13
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Publication No.: US20160268049A1Publication Date: 2016-09-15
- Inventor: Jan Petrzilek , Jiri Navratil , Martin Biler
- Applicant: AVX Corporation
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/224 ; H01G4/236 ; H01G4/02

Abstract:
A capacitor assembly configured to effectively dissipate heat when exposed to a high ripple current is provided. The assembly includes a plurality of capacitor elements, each including an anode body and lead, a dielectric layer overlying the anode body, and a solid electrolyte. Each capacitor element is defined by upper and lower major surfaces, first opposing minor surfaces, and second opposing minor surfaces. The major surfaces each have a surface area greater than that of each of the minor opposing surfaces. A hermetically sealed housing having a length, width, and height defines an interior cavity within which the plurality of capacitor elements are positioned. The ratio of the length to the height ranges from about 2 to about 80. Further, the lower major face of each capacitor element faces a lower wall of the housing, where the lower wall is defined by the housing's length and width.
Public/Granted literature
- US10014108B2 Low profile multi-anode assembly Public/Granted day:2018-07-03
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