Invention Application
- Patent Title: METHOD OF INTERFACIAL OXIDE LAYER FORMATION IN SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体器件中界面氧化层形成的方法
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Application No.: US14662142Application Date: 2015-03-18
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Publication No.: US20160276165A1Publication Date: 2016-09-22
- Inventor: CHUEH-YANG LIU , YI-LIANG YE , TED MING-LANG GUO , YU-REN WANG
- Applicant: UNITED MICROELECTRONICS CORPORATION
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/02

Abstract:
A method of an interfacial oxide layer formation comprises a plurality of steps. The step (S1) is to remove a native oxide layer from a surface of a substrate; the step (S2) is to form an oxide layer on a surface of a substrate by piranha solution (SPM); the step (S3) is to cleaning a surface of the oxide layer by standard clean 1 (SC1), and the step (S4) is to etch he oxide layer by a solution comprising diluted hydrogen fluoride (dHF) and ozonized pure water (DIO3).
Public/Granted literature
- US09570315B2 Method of interfacial oxide layer formation in semiconductor device Public/Granted day:2017-02-14
Information query
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