发明申请
US20160276452A1 Method for Manufacturing a Semiconductor Device Having a Schottky Contact
审中-公开
具有肖特基接触的半导体器件的制造方法
- 专利标题: Method for Manufacturing a Semiconductor Device Having a Schottky Contact
- 专利标题(中): 具有肖特基接触的半导体器件的制造方法
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申请号: US15040353申请日: 2016-02-10
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公开(公告)号: US20160276452A1公开(公告)日: 2016-09-22
- 发明人: Jens Peter Konrath , Ronny Kern , Stefan Krivec , Ulrich Schmid , Laura Stoeber
- 申请人: Infineon Technologies Austria AG
- 优先权: DE102015101966.3 20150211
- 主分类号: H01L29/47
- IPC分类号: H01L29/47 ; H01L29/20 ; H01L29/16 ; H01L29/161 ; H01L21/02 ; H01L21/285
摘要:
A semiconductor device includes an n-doped monocrystalline semiconductor substrate having a substrate surface, an amorphous n-doped semiconductor surface layer at the substrate surface of the n-doped monocrystalline semiconductor substrate, and a Schottky-junction forming material in contact with the amorphous n-doped semiconductor surface layer. The Schottky-junction forming material forms at least one Schottky contact with the amorphous n-doped semiconductor surface layer.
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