Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Patent Title (中): 基板处理装置和基板处理方法
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Application No.: US15185177Application Date: 2016-06-17
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Publication No.: US20160289839A1Publication Date: 2016-10-06
- Inventor: Masahiko HARUMOTO , Tadashi MIYAGI , Yukihiko INAGAKI , Koji KANEYAMA
- Applicant: SCREEN Semiconductor Solutions Co., Ltd.
- Priority: JP2012-159917 20120718
- Main IPC: C23C16/56
- IPC: C23C16/56 ; G03F7/32 ; G03F7/20 ; C23C16/02 ; H01L21/033
Abstract:
An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.
Public/Granted literature
- US09828676B2 Substrate processing apparatus and substrate processing method Public/Granted day:2017-11-28
Information query
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