Invention Application
- Patent Title: THIN FILM CAPACITOR
- Patent Title (中): 薄膜电容器
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Application No.: US15083649Application Date: 2016-03-29
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Publication No.: US20160293334A1Publication Date: 2016-10-06
- Inventor: Shinji EHARA , Ikuhito ONODERA , Eiko WAKATA , Katsunori OSANAI , Masamichi TANIGUCHI
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-073872 20150331; JP2015-073886 20150331; JP2015-073957 20150331
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G4/30 ; H01L49/02 ; H01G4/012 ; H01G4/018 ; H01G4/008 ; H01G4/224

Abstract:
A lower electrode (4) can have an uneven surface structure. An upper electrode (6) can also have the uneven surface structure. A projecting portion of the upper electrode (6) projecting to the lower electrode side is positioned in a gap between projecting portions of the lower electrode (4) and the lower electrode (4) includes Cu as a main component. Young's moduli of a substrate (1), a stress adjustment layer (2), and the lower electrode (4) have a specific relation. Also, corner portions of radii (R1) of curvature positioned inside a projecting portion (4b) have a specific relation.
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