公开(公告)号：US20230037194A1

公开(公告)日：2023-02-02

申请号：US17788606

申请日：2020-12-04

Applicant: TDK Corporation

Inventor： Koji KUROKI ,  Ikuhito ONODERA ,  Osamu HARAKAWA ,  Makoto KAMENO

IPC: G01R33/09 ,  G01R33/00

Abstract: To increase, in a magnetic sensor having a magnetoresistive strip and a ferromagnetic film, a magnetic bias to be applied to a magnetoresistive element by magnetically coupling the magnetoresistive strip and ferromagnetic film. A magnetic sensor 1 includes a magnetoresistive strip S, an insulating film 13 that covers the magnetoresistive strip S, and ferromagnetic films M1 and M2 formed on the insulating film 13 and arranged in the x-direction through a magnetic gap G extending in the y-direction. The ferromagnetic films M1 and M2 overlap a plurality of hard magnetic members H through the insulating film 13. This allows two adjacent hard magnetic members H to be magnetically coupled through the ferromagnetic films M1 and M2. This makes it possible to increase the magnetic bias to be applied to a magnetoresistive element R without involving an increase in the size of the hard magnetic member H.

公开(公告)号：US20250164584A1

公开(公告)日：2025-05-22

申请号：US18840684

申请日：2022-02-25

Applicant: TDK CORPORATION

Inventor： Ikuhito ONODERA ,  Osamu HARAKAWA

IPC: G01R33/09 ,  G01R33/00

Abstract: To accurately perform positioning of an external magnetic body with respect to a sensor chip. After mounting of a sensor chip on a substrate, an external magnetic body is mounted on the substrate so as to overlap a magnetic layer as viewed in the Y-direction perpendicular to an element formation surface. Further, the position of the external magnetic body in the X-direction is adjusted with reference to alignment marks which are provided so as to be visually confirmable from an upper surface side of the sensor chip. Thus, in a magnetic sensor assembly, a desired positional relation can be established between the sensor chip and the external magnetic body.

公开(公告)号：US20160293334A1

公开(公告)日：2016-10-06

申请号：US15083649

申请日：2016-03-29

Applicant: TDK CORPORATION

Inventor： Shinji EHARA ,  Ikuhito ONODERA ,  Eiko WAKATA ,  Katsunori OSANAI ,  Masamichi TANIGUCHI

IPC: H01G4/33 ,  H01G4/30 ,  H01L49/02 ,  H01G4/012 ,  H01G4/018 ,  H01G4/008 ,  H01G4/224

CPC classification number: H01G4/33 ,  H01G4/008 ,  H01G4/012 ,  H01G4/018 ,  H01G4/224 ,  H01G4/306 ,  H01L28/92

Abstract: A lower electrode (4) can have an uneven surface structure. An upper electrode (6) can also have the uneven surface structure. A projecting portion of the upper electrode (6) projecting to the lower electrode side is positioned in a gap between projecting portions of the lower electrode (4) and the lower electrode (4) includes Cu as a main component. Young's moduli of a substrate (1), a stress adjustment layer (2), and the lower electrode (4) have a specific relation. Also, corner portions of radii (R1) of curvature positioned inside a projecting portion (4b) have a specific relation.

Abstract translation: 下电极（4）可以具有不均匀的表面结构。 上电极（6）也可以具有不平坦的表面结构。 上部电极（6）的突出于下部电极侧的突出部分位于下部电极（4）的突出部分之间的间隙中，下部电极（4）包括Cu作为主要部件。 衬底（1），应力调节层（2）和下电极（4）的杨氏模具具有特定的关系。 此外，位于突出部分（4b）内部的曲率半径（R1）的角部分具有特定的关系。