Invention Application
- Patent Title: SEMICONDUCTOR PACKAGING STRUCTURE AND SEMICONDUCTOR POWER DEVICE THEREOF
- Patent Title (中): 半导体封装结构和半导体功率器件
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Application No.: US15077927Application Date: 2016-03-23
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Publication No.: US20160293755A1Publication Date: 2016-10-06
- Inventor: Chao-Feng CAI , Jian-Hong ZENG , Zeng LI
- Applicant: DELTA ELECTRONICS, INC.
- Priority: CN201510154626.2 20150402
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L23/48 ; H01L23/538 ; H01L23/50
Abstract:
A semiconductor packaging structure includes a chip, a first pin, a second pin, and a third pin. The chip includes a first surface, a second surface, a first power switch, and a second switch, and both the first power switch and the second switch include a first terminal and a second terminal. The second surface of the chip is opposite to the first surface of the chip. The first pin does not contact to the second pin. The first terminal of the first power switch of the chip is coupled to the first pin, and the second terminal of the first power switch of the chip is coupled to the third pin. The first terminal of the second power switch of the chip is coupled to the third pin, and the second terminal of the second power switch of the chip is coupled to the second pin.
Public/Granted literature
- US09755070B2 Semiconductor packaging structure and semiconductor power device thereof Public/Granted day:2017-09-05
Information query
IPC分类:
