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公开(公告)号：US20160300657A1
公开(公告)日：2016-10-13
申请号：US15092629
申请日：2016-04-07
Applicant: DELTA ELECTRONICS, INC.
Inventor： Rui WU , Jin-Ping ZHOU , Yu ZHANG , Jian-Hong ZENG , Min ZHOU
CPC classification number: H01F3/10 , H01F37/00 , H01F2003/106
Abstract: An integrated inductor apparatus integrated to be a plurality of inductors is provided. The integrated inductor apparatus includes inductor windings to form inductors and includes at least two windows each having at least one of the inductor windings disposed therein and magnetic core units, each having a closed geometrical structure to form one of the at least two windows, wherein two of the neighboring magnetic core units have a shared magnetic core part. The magnetic core units comprise at least two kinds of material having different magnetic permeability corresponding to different sections of the magnetic core units, wherein the reluctance of the shared magnetic core part is smaller than the reluctance of a non-shared magnetic core part of the magnetic core units.
Abstract translation: 提供集成为多个电感器的集成电感器装置。 集成电感器设备包括电感器绕组以形成电感器，并且包括至少两个窗口，每个窗口中至少有一个电感器绕组设置在其中，磁芯单元各自具有闭合的几何结构以形成至少两个窗口之一，其中两个窗口 的相邻磁芯单元具有共享磁芯部分。 磁芯单元包括与磁芯单元的不同部分对应的不同导磁率的至少两种材料，其中共享磁芯部分的磁阻小于磁共享磁芯部分的磁阻的磁阻 核心单位。
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公开(公告)号：US20170309746A1
公开(公告)日：2017-10-26
申请号：US15647278
申请日：2017-07-12
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Feng CAI , Jian-Hong ZENG , Zeng LI
CPC classification number: H01L29/7826 , H01L23/50 , H01L24/20 , H01L24/24 , H01L29/1083 , H01L29/402 , H01L29/41766 , H01L29/7816 , H01L2224/04105 , H01L2224/18 , H01L2924/19104
Abstract: A semiconductor packaging structure includes a chip, a first pin, a second pin, and a third pin. The chip includes a first surface, a second surface, a first power switch, and a second switch, and both the first power switch and the second switch include a first terminal and a second terminal. The second surface of the chip is opposite to the first surface of the chip. The first pin does not contact to the second pin. The first terminal of the first power switch of the chip is coupled to the first pin, and the second terminal of the first power switch of the chip is coupled to the third pin. The first terminal of the second power switch of the chip is coupled to the third pin, and the second terminal of the second power switch of the chip is coupled to the second pin.
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公开(公告)号：US20160062428A1
公开(公告)日：2016-03-03
申请号：US14840063
申请日：2015-08-31
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jian-Hong ZENG , Chao YAN , Pei-Qing HU
IPC: G06F1/26
Abstract: Disclosed herein is a power supply apparatus that includes a main board, a power unit, a control unit, pads and a pin. The control unit and the power unit are stacked on the main board and at a position in adjacent to a load; the plurality of pads are distributed along the lateral side of the power unit and the lateral side of the control unit; the plurality of pins and pads are electrically coupled and electrically coupled with the main board, the control unit and the power unit; the control unit is configured to control the power unit, so that the power unit supplies electricity to the adjacent load.
Abstract translation: 这里公开了一种电源装置，其包括主板，功率单元，控制单元，焊盘和引脚。 控制单元和动力单元堆叠在主板上和与负载相邻的位置; 所述多个焊盘沿着所述动力单元的横向侧和所述控制单元的横向侧分布; 多个引脚和焊盘电耦合并与主板，控制单元和电源单元电耦合; 控制单元被配置为控制功率单元，使得功率单元向相邻负载供电。
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公开(公告)号：US20190296150A1
公开(公告)日：2019-09-26
申请号：US16436939
申请日：2019-06-11
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Feng CAI , Jian-Hong ZENG , Zeng LI , Xiao-Ni XIN
Abstract: A semiconductor packaging structure includes a chip, a first pin, a second pin, and a third pin. The chip includes a first surface, a second surface, a first power switch, and a second switch, and both the first power switch and the second switch include a first terminal and a second terminal. The second surface of the chip is opposite to the first surface of the chip. The first pin does not contact to the second pin. The first terminal of the first power switch of the chip is coupled to the first pin, and the second terminal of the first power switch of the chip is coupled to the third pin. The first terminal of the second power switch of the chip is coupled to the third pin, and the second terminal of the second power switch of the chip is coupled to the second pin.
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公开(公告)号：US20170104419A1
公开(公告)日：2017-04-13
申请号：US15285473
申请日：2016-10-04
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jian-Hong ZENG , Xiao-Ni XIN , Rui WU , Min ZHOU , Hao-Yi YE
CPC classification number: H02M7/003 , H01F38/14 , H01F2017/065 , H02M3/00 , H02M3/158 , H02M5/293 , H02M7/537
Abstract: A power converter device includes a power element module, a conductor, and a magnetic-conductive assembly. The power element module includes at least two electrodes and a power semiconductor unit. Voltage among these electrodes is AC voltage. The power semiconductor unit includes at least one pure die, and the pure die includes plural surfaces. The surface which occupies the most area of the pure die is the pure die surface. The conductor is coupled to the power element module. A current loop forms between the power element module and the conductor. A magnetic loop forms in the magnetic-conductive assembly. The magnetic-conductive assembly includes a chamber. The current loop passes through the chamber and intersects the magnetic loop to form inductance which the current loop needs. A part of the power element module is disposed in the chamber.
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Patent Agency Ranking
公开(公告)号：US20170104410A1
公开(公告)日：2017-04-13
申请号：US15286542
申请日：2016-10-05
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jian-Hong ZENG , Shou-Yu HONG , Xiao-Ni XIN , Pei-Qing HU
IPC: H02M3/156 , H05K1/02 , H05K1/18 , H05K3/22 , H01F27/24 , H05K3/30 , H05K3/40 , H05K1/11 , H01F27/28
CPC classification number: H02M3/156 , H01F27/24 , H01F27/28 , H01F27/292 , H01F41/02 , H05K1/028 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/18 , H05K1/181 , H05K3/22 , H05K3/305 , H05K3/4038 , H05K2201/1003 , H05K2201/10946 , H05K2203/02 , H05K2203/0228
Abstract: A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at ⅓ to ⅔ of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.
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7.发明申请公开(公告)号：US20130214842A1
公开(公告)日：2013-08-22
申请号：US13845118
申请日：2013-03-18
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jian-Hong ZENG , Shou-Yu HONG , Xue-Tao GUO
CPC classification number: H02M1/143 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/50 , H01L2224/0603 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4846 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , H02M7/5388 , H05K5/064 , H05K7/1432 , H05K7/209 , H01L2924/00014 , H01L2924/00 , H01L2224/48472 , H01L2924/00012
Abstract: A power system, a power module therein and a method for fabricating power module are disclosed herein. The power module includes a first and a second common pins, and a first and a second bridge arms. The first and the second common pins are symmetrically disposed at one side of a substrate. The first bridge arm includes a first and a second semiconductor devices, and the first and the second semiconductor devices are connected to each other through the first common pin and disposed adjacently. The second bridge arm includes a third and a fourth semiconductor devices, and the third and the fourth semiconductor devices are connected to each other through the second common pin and disposed adjacently. The first and the third semiconductor devices are disposed symmetrically, and the second and the fourth semiconductor devices are disposed symmetrically.
Abstract translation: 本文公开了一种电力系统及其功率模块及其制造功率模块的方法。 功率模块包括第一和第二公共引脚，以及第一和第二桥臂。 第一和第二公共销对称地设置在基板的一侧。 第一桥臂包括第一和第二半导体器件，并且第一和第二半导体器件通过第一公共引脚彼此连接并相邻地设置。 第二桥臂包括第三和第四半导体器件，并且第三和第四半导体器件通过第二公共引脚彼此连接并相邻地设置。 第一和第三半导体器件对称设置，第二和第四半导体器件对称地设置。
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公开(公告)号：US20210226552A1
公开(公告)日：2021-07-22
申请号：US17226105
申请日：2021-04-09
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jian-Hong ZENG , Xiao-Ni XIN , Rui WU , Min ZHOU , Hao-Yi YE
Abstract: A power converter device includes a first current level, a second current level, a first magnetic layer and a second magnetic layer. The first current level and the second current level are used to load a current loop which has AC current component. The current loop includes a power element module and a conductor coupled to the power element module. The power element module includes at least two electrodes. Voltage among the at least two electrodes is AC voltage. AC current magnitudes of the at least two electrodes are substantially equal and in the opposite direction. The first magnetic layer and the second magnetic layer are used to load a magnetic loop which includes AC magnetic flux component. The first magnetic layer and the second magnetic layer are disposed in two opposite sides of the first current level.
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公开(公告)号：US20180232026A1
公开(公告)日：2018-08-16
申请号：US15952224
申请日：2018-04-12
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jian-Hong ZENG
Abstract: Disclosed herein is a power supply apparatus that includes a bearing plate, insulation material and a plurality of pins. The insulation material is formed on two opposite surfaces of the bearing plate. The plurality of pins are electrically connected to the bearing plate and allocated along lateral sides of the insulation material.
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公开(公告)号：US20170194086A1
公开(公告)日：2017-07-06
申请号：US15464326
申请日：2017-03-20
Applicant: DELTA ELECTRONICS, INC.
Inventor： Jin-Ping ZHOU , Rui WU , Jian-Hong ZENG , Yu ZHANG , Min ZHOU
CPC classification number: H01F27/24 , H01F3/10 , H01F3/14 , H01F27/006 , H01F27/2823 , H01F37/00 , H01F2003/106
Abstract: A magnetic core is provided. The magnetic core includes a plurality of magnetic core units each having at least one non-shared magnetic core part that is not shared with the neighboring magnetic core unit, wherein a reluctance of the shared magnetic core part is smaller than the reluctance of a non-shared magnetic core part of the magnetic core units, and directions of a direct current magnetic flux in the shared magnetic core part of the neighboring two magnetic core units are opposite.
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