Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US15091009Application Date: 2016-04-05
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Publication No.: US20160300952A1Publication Date: 2016-10-13
- Inventor: Satoshi TORIUMI , Takashi HAMADA , Tetsunori MARUYAMA , Yuki IMOTO , Yuji ASANO , Ryunosuke HONDA , Shunpei YAMAZAKI
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Priority: JP2015-081993 20150413; JP2015-082008 20150413
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/51 ; H01L27/105 ; H01L29/417 ; H01L27/12 ; H01L29/24 ; H01L29/49

Abstract:
A minute transistor is provided. A semiconductor device includes a semiconductor over a substrate, a first conductor and a second conductor over the semiconductor, a first insulator over the first conductor and the second conductor, a second insulator over the semiconductor, a third insulator over the second insulator, and a third conductor over the third insulator. The third insulator is in contact with a side surface of the first insulator. The semiconductor includes a first region where the semiconductor overlaps with a bottom surface of the first conductor, a second region where the semiconductor overlaps with a bottom surface of the second conductor, and a third region where the semiconductor overlaps with a bottom surface of the third conductor. The length between a top surface of the semiconductor and the bottom surface of the third conductor is longer than the length between the first region and the third region.
Public/Granted literature
- US10693013B2 Semiconductor device and manufacturing method of the same Public/Granted day:2020-06-23
Information query
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