Invention Application
US20160307943A1 Stacked Grid Design for Improved Optical Performance and Isolation
有权
堆叠网格设计，提高光学性能和隔离度
- Patent Title: Stacked Grid Design for Improved Optical Performance and Isolation
- Patent Title (中): 堆叠网格设计，提高光学性能和隔离度
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Application No.: US14713172Application Date: 2015-05-15
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Publication No.: US20160307943A1Publication Date: 2016-10-20
- Inventor: Yun-Wei Cheng , Horng Huei Tseng , Chao-Hsiung Wang , Chun-Hao Chou , Tsung-Han Tsai , Kuo-Cheng Lee , Tzu-Hsuan Hsu , Yung-Lung Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A back side illumination (BSI) image sensor with a dielectric grid opening having a planar lower surface is provided. A pixel sensor is arranged within a semiconductor substrate. A metallic grid is arranged over the pixel sensor and defines a sidewall of a metallic grid opening. A dielectric grid is arranged over the metallic grid and defines a sidewall of the dielectric grid opening. A capping layer is arranged over the metallic grid, and defines the planar lower surface of the dielectric grid opening.
Public/Granted literature
- US09991307B2 Stacked grid design for improved optical performance and isolation Public/Granted day:2018-06-05
Information query
IPC分类:
