Invention Application
- Patent Title: MAKING MULTILAYER 3D CAPACITORS USING ARRAYS OF UPSTANDING RODS OR RIDGES
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Application No.: US15207837Application Date: 2016-07-12
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Publication No.: US20160322456A1Publication Date: 2016-11-03
- Inventor: Liang WANG , Rajesh KATKAR , Hong SHEN , Cyprian Emeka UZOH
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L49/02
- IPC: H01L49/02

Abstract:
In one embodiment, a method for making a 3D Metal-Insulator-Metal (MIM) capacitor includes providing a substrate having a surface, forming an array of upstanding rods or ridges on the surface, depositing a first layer of an electroconductor on the surface and the array of rods or ridges, coating the first electroconductive layer with a layer of a dielectric, and depositing a second layer of an electroconductor on the dielectric layer. In some embodiments, the array of rods or ridges can be made of a photoresist material, and in others, can comprise bonded wires.
Public/Granted literature
- US09865675B2 Making multilayer 3D capacitors using arrays of upstanding rods or ridges Public/Granted day:2018-01-09
Information query
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