Invention Application
- Patent Title: ACOUSTIC DEVICE PACKAGE AND METHOD OF MAKING
- Patent Title (中): 声学设备包装及其制作方法
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Application No.: US14698616Application Date: 2015-04-28
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Publication No.: US20160322557A1Publication Date: 2016-11-03
- Inventor: Enis Tuncer , Abram Castro
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L41/08
- IPC: H01L41/08 ; H03H3/007
Abstract:
An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.
Public/Granted literature
- US10284172B2 Acoustic device package and method of making Public/Granted day:2019-05-07
Information query
IPC分类:
