- 专利标题： ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
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申请号： US15215053申请日： 2016-07-20
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公开(公告)号： US20160327220A1公开(公告)日： 2016-11-10
- 发明人: Michael A. TISCHLER , Philippe M. SCHICK , Ian ASHDOWN , Calvin Wade SHEEN , Paul JUNGWIRTH
- 申请人： Michael A. TISCHLER , Philippe M. SCHICK , Ian ASHDOWN , Calvin Wade SHEEN , Paul JUNGWIRTH
- 主分类号： F21K9/66
- IPC分类号： F21K9/66 ; H01L23/498 ; H01L23/00 ; H01L33/62 ; H01L33/36 ; H01L33/50 ; H01L33/48 ; H05K1/18 ; H05K3/32 ; F21V3/02 ; F21V9/16 ; F21V23/00 ; F21V23/02 ; F21K9/278 ; F21K9/275 ; F21V29/74 ; H05B37/02 ; H05B33/08 ; F21K9/64 ; H01L25/075
摘要：
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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