Invention Application
US20160329341A1 THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METHOD OF MAKING THEREOF 审中-公开
具有良好接触柱的三维存储器件及其制造方法

THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METHOD OF MAKING THEREOF
Abstract:
A monolithic three dimensional memory device includes a semiconductor substrate having a major surface and a doped well region of a first conductivity type extending substantially parallel to the major surface of the semiconductor substrate, a plurality of NAND memory strings extending substantially perpendicular to the major surface of the semiconductor substrate, and a plurality of substantially pillar-shaped support members extending substantially perpendicular to the major surface of the semiconductor substrate, each support member including an electrically insulating outer material surrounding an electrically conductive core material that extends substantially perpendicular to the major surface of the semiconductor substrate and electrically contacting the doped well region.
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