Invention Application
US20160329341A1 THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METHOD OF MAKING THEREOF
审中-公开
具有良好接触柱的三维存储器件及其制造方法
- Patent Title: THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METHOD OF MAKING THEREOF
- Patent Title (中): 具有良好接触柱的三维存储器件及其制造方法
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Application No.: US15216941Application Date: 2016-07-22
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Publication No.: US20160329341A1Publication Date: 2016-11-10
- Inventor: Seiji Shimabukuro , Ryoichi Honma , Hiroyuki Ogawa , Yuki Mizutani , Fumiaki Toyama
- Applicant: SANDISK TECHNOLOGIES LLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L23/522

Abstract:
A monolithic three dimensional memory device includes a semiconductor substrate having a major surface and a doped well region of a first conductivity type extending substantially parallel to the major surface of the semiconductor substrate, a plurality of NAND memory strings extending substantially perpendicular to the major surface of the semiconductor substrate, and a plurality of substantially pillar-shaped support members extending substantially perpendicular to the major surface of the semiconductor substrate, each support member including an electrically insulating outer material surrounding an electrically conductive core material that extends substantially perpendicular to the major surface of the semiconductor substrate and electrically contacting the doped well region.
Public/Granted literature
- US09768186B2 Three dimensional memory device having well contact pillar and method of making thereof Public/Granted day:2017-09-19
Information query
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