Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体器件
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Application No.: US15149240Application Date: 2016-05-09
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Publication No.: US20160336251A1Publication Date: 2016-11-17
- Inventor: Daisuke FUKUOKA
- Applicant: DENSO CORPORATION
- Priority: JP2015-96492 20150511
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L29/739 ; H02M7/44 ; H01L29/16 ; H01L27/06 ; H01L23/31 ; H01L29/861
Abstract:
A semiconductor device includes a semiconductor chip, a metal member, and a terminal. The semiconductor chip has an electrode. The metal member is electrically connected to the electrode. The terminal extends from the metal member to be connected to an external connection member. The terminal has a width-increased portion in a predetermined area beginning from a first end of the terminal that connects to the metal member.
Public/Granted literature
- US09762140B2 Semiconductor device Public/Granted day:2017-09-12
Information query
IPC分类:
