Invention Application
- Patent Title: Semiconductor Device Containing HEMT and MISFET and Method of Forming the Same
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Application No.: US15224263Application Date: 2016-07-29
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Publication No.: US20160336314A1Publication Date: 2016-11-17
- Inventor: Chung-Yen Chou , Sheng-De Liu , Fu-Chih Yang , Shih-Chang Liu , Chia-Shiung Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/06 ; H01L29/778 ; H01L29/20 ; H01L29/51 ; H01L29/66 ; H01L21/8252 ; H01L29/10

Abstract:
A semiconductor structure with a MISFET and a HEMT region includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A third III-V compound layer is disposed on the second III-V compound layer is different from the second III-V compound layer in composition. A source feature and a drain feature are disposed in each of the MISFET and HEMT regions on the third III-V compound layer. A gate electrode is disposed over the second III-V compound layer between the source feature and the drain feature. A gate dielectric layer is disposed under the gate electrode in the MISFET region but above the top surface of the third III-V compound layer.
Public/Granted literature
- US09911734B2 Semiconductor device containing HEMT and MISFET and method of forming the same Public/Granted day:2018-03-06
Information query
IPC分类: