Invention Application
- Patent Title: PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 包装结构及其制造方法
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Application No.: US14799593Application Date: 2015-07-15
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Publication No.: US20160343645A1Publication Date: 2016-11-24
- Inventor: Pi-Te Pan , Chang-Fu Chen
- Applicant: Unimicron Technology Corp.
- Priority: TW104116526 20150522
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00
Abstract:
Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.
Public/Granted literature
- US09559045B2 Package structure and method for manufacturing the same Public/Granted day:2017-01-31
Information query
IPC分类:
