Invention Application
- Patent Title: SUBSTRATE WITH INSULATING LAYER
- Patent Title (中): 带绝缘层的基板
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Application No.: US15031594Application Date: 2014-02-14
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Publication No.: US20160345451A1Publication Date: 2016-11-24
- Inventor: KUAN-TING WU , YU-CHUAN KANG , CHUNG-HUNG HUANG
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- International Application: PCT/US2014/016400 WO 20140214
- Main IPC: H05K5/02
- IPC: H05K5/02 ; C25D13/10 ; C09D5/44 ; C25D13/22 ; C25D15/00 ; H05K5/04 ; C25D11/02 ; C25D13/14
Abstract:
A substrate with a Micro-Arc Oxidation (MAO) layer or an electrophoretic deposition (ED) layer on a first side of the substrate and an electrically insulating layer on a second side of the substrate.
Public/Granted literature
- US10244647B2 Substrate with insulating layer Public/Granted day:2019-03-26
Information query
