公开(公告)号：US20170183781A1

公开(公告)日：2017-06-29

申请号：US15309535

申请日：2014-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P

Inventor： KUAN-TING WU ,  JAMES CHANG ,  YU-CHUAN KANG

IPC: C23C28/00 ,  B32B15/08

CPC classification number: C23C28/00 ,  B32B15/08

Abstract: An example composite material composed of a metal or multilayered metal substrate onto which an elastomer or elastomeric mixture is positioned by electrophoretic disposition. The elastomer or elastomeric mixture forms a flexible non-rigid elastomeric coating, which imparts a soft touch tactile feeling to the metal base substrate.

公开(公告)号：US20160339537A1

公开(公告)日：2016-11-24

申请号：US15111533

申请日：2014-02-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  YU-CHUAN KANG

IPC: B23K20/02 ,  B21D22/02 ,  B23K20/16 ,  B21D51/16

CPC classification number: B23K20/023 ,  B21D22/022 ,  B21D51/16 ,  B23K20/16 ,  B23K2101/36 ,  B23K2103/10 ,  B23K2103/15

Abstract: A method of forming a casing of an electronic device is described in which heat and pressure are applied to a metal substrate and a metal layer in a molding device. The metal substrate and the metal layer are molded into a shape of the casing. At the same time, an intermediate phase between the metal substrate and the metal layer is formed by inter-diffusion bonding.

Abstract translation: 描述了一种形成电子装置的壳体的方法，其中在模制装置中的金属基底和金属层上施加热和压力。 将金属基板和金属层模制成壳体的形状。 同时，通过相互扩散接合形成金属基板和金属层之间的中间相。

公开(公告)号：US20160326664A1

公开(公告)日：2016-11-10

申请号：US15030283

申请日：2014-01-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  NING CHANG ,  YU-CHUAN KANG

IPC: C25D13/22 ,  H05K5/04 ,  C09D5/24 ,  B41M5/00 ,  C09D5/44

CPC classification number: C25D13/22 ,  B41M5/0058 ,  C09D5/24 ,  C09D5/4411 ,  C09D5/443 ,  C25D13/12 ,  H04M1/0283 ,  H05K5/04

Abstract: A coating of dots is applied to a surface of a metal substrate and an electrophoretic deposition is applied in-between the dots. Either the dots or the electrophoretic deposition are transparent or translucent.

Abstract translation: 将点涂层施加到金属基板的表面上，并且在点之间施加电泳沉积。 点或电泳沉积是透明或半透明的。

公开(公告)号：US20180244949A1

公开(公告)日：2018-08-30

申请号：US15758130

申请日：2015-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YU-CHUAN KANG ,  CHI-HAO CHANG

IPC: C09D175/04 ,  C09D1/00

CPC classification number: C09D175/04 ,  C08G18/4854 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08L25/06 ,  C08L27/06 ,  C08L27/16 ,  C08L27/18 ,  C08L33/08 ,  C08L55/02 ,  C08L63/00 ,  C08L69/00 ,  C08L77/00 ,  C08L79/08 ,  C09D1/00 ,  C09D7/61 ,  C09D175/08 ,  C08K5/5415 ,  C08L33/12

Abstract: This disclosure provides a sol-gel hybrid coating composition, comprising a sol-gel precursor, a polymer and a solvent, wherein the sol-gel precursor comprises tetraethyl orthosilicate and the polymer comprises polyurethane and polyacrylic. This disclosure also provides a coating process, comprising: subjecting a light metal to micro-arc oxidation treatment to form a first protection layer on the light metal, and coating the sol-gel hybrid coating composition onto the first protection layer to form a second protection layer. This disclosure further provides composite coating layers, comprising: a first layer obtained by micro-arc oxidation treatment, and a second layer obtained by dip coating with the sol-gel hybrid coating composition.

公开(公告)号：US20160326624A1

公开(公告)日：2016-11-10

申请号：US15105416

申请日：2014-01-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： YU-CHUAN KANG ,  KUAN-TING WU

IPC: C23C4/12 ,  C23C4/134 ,  C23C4/131 ,  C23C28/00 ,  C23C4/126 ,  C25D11/02 ,  C25D13/20 ,  C23C4/08 ,  C23C4/129

Abstract: A method is provided for treating a metal substrate. The method comprises applying a metal layer to the substrate using a thermal spray process and electrochemically treating the metal layer to form a coating.

Abstract translation: 提供了一种处理金属基板的方法。 该方法包括使用热喷涂法将金属层施加到基底上，并对金属层进行电化学处理以形成涂层。

公开(公告)号：US20160231775A1

公开(公告)日：2016-08-11

申请号：US15021476

申请日：2013-10-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHUNG-HUNG HUANG ,  YU-CHUAN KANG ,  CHIEN-TING LIN ,  KUAN-TING WU

IPC: G06F1/16 ,  B32B1/02 ,  C25D11/02 ,  B32B15/08

CPC classification number: G06F1/1626 ,  B32B1/02 ,  B32B15/08 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2457/00 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/10 ,  C25D11/26 ,  C25D11/30 ,  G06F2200/1633 ,  H04M1/0283

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

Abstract translation: 提供了一种将转印膜施加到金属表面的方法。 该方法包括电化学处理金属以形成氧化物层，在其上施加转移膜。

公开(公告)号：US20180297173A1

公开(公告)日：2018-10-18

申请号：US15519700

申请日：2015-04-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  CHI HAO CHANG ,  YU-CHUAN KANG

IPC: B24D3/34 ,  B24C11/00 ,  C25D5/42 ,  C25D13/20 ,  C25D13/04 ,  C09D5/44 ,  C09G1/02 ,  C09K3/14

Abstract: One example provides a method. The method includes forming a substrate comprising a metal alloy comprising at least one of aluminium, magnesium, lithium, zinc, titanium, niobium, and copper. The method includes polishing a surface of the substrate using particles comprising chromium metal. The polished surface is electrically conductive.

公开(公告)号：US20170096732A1

公开(公告)日：2017-04-06

申请号：US15308303

申请日：2014-06-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YU-CHUAN KANG ,  YAO-WEN FAN

IPC: C23C14/00 ,  C25D13/06 ,  G06F1/16 ,  C23C14/46 ,  C23C14/35 ,  C25D13/02 ,  C25D13/22

CPC classification number: C23C14/0036 ,  C23C14/024 ,  C23C14/16 ,  C23C14/35 ,  C23C14/46 ,  C23C28/00 ,  C25D13/02 ,  C25D13/06 ,  C25D13/14 ,  C25D13/22 ,  G06F1/1656

Abstract: Example implementations relate to manufacturing multilayer coatings on substrates. In examples, a substrate with an electrically conducting surface may be provided. A first layer of a first material may be electrophoretically deposited on at least a portion of the electrically conducting surface of the substrate. A second layer of a second, electrically conducting material may be deposited on at least a portion of the first layer using physical vapor deposition. A third layer of a third material may be electrophoretically deposited on at least a portion of the second layer.

公开(公告)号：US20160345451A1

公开(公告)日：2016-11-24

申请号：US15031594

申请日：2014-02-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YU-CHUAN KANG ,  CHUNG-HUNG HUANG

IPC: H05K5/02 ,  C25D13/10 ,  C09D5/44 ,  C25D13/22 ,  C25D15/00 ,  H05K5/04 ,  C25D11/02 ,  C25D13/14

CPC classification number: H05K5/0247 ,  C09D5/4411 ,  C09D5/443 ,  C25D11/022 ,  C25D11/026 ,  C25D11/06 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  C25D13/10 ,  C25D13/12 ,  C25D13/14 ,  C25D13/22 ,  C25D15/00 ,  H05K5/04

Abstract: A substrate with a Micro-Arc Oxidation (MAO) layer or an electrophoretic deposition (ED) layer on a first side of the substrate and an electrically insulating layer on a second side of the substrate.

Abstract translation: 在衬底的第一侧上具有微弧氧化（MAO）层或电泳沉积（ED）层的衬底和在衬底的第二侧上的电绝缘层。

公开(公告)号：US20160324026A1

公开(公告)日：2016-11-03

申请号：US15105148

申请日：2014-01-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： YU-CHUAN KANG ,  KUAN-TING WU

IPC: H05K5/04 ,  C09D5/44 ,  C25D11/02 ,  C25D13/22 ,  C25D13/20

CPC classification number: H05K5/04 ,  A45C5/02 ,  A45C11/00 ,  A45C2011/002 ,  B05D1/02 ,  B44C5/04 ,  C09D5/4411 ,  C25D11/026 ,  C25D13/20 ,  C25D13/22 ,  H04M1/0283

Abstract: A casing for electrical devices is provided. The casing comprises an intermediate layer of less reactive light metal 120 sandwiched between a substrate layer of more reactive light metal 130 and a coat layer 110.

Abstract translation: 提供了一种用于电气设备的外壳。 壳体包括夹在更反应性轻金属130的基底层和涂层110之间的较少反应性的轻金属120的中间层。