Invention Application
- Patent Title: POWER CIRCUIT MODULE
- Patent Title (中): 电源电路模块
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Application No.: US15165273Application Date: 2016-05-26
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Publication No.: US20160352244A1Publication Date: 2016-12-01
- Inventor: Wei CHENG , Shouyu HONG , Zhenqing ZHAO , Tao WANG
- Applicant: DELTA ELECTRONICS,INC.
- Applicant Address: CN TAOYUAN CITY
- Assignee: DELTA ELECTRONICS,INC.
- Current Assignee: DELTA ELECTRONICS,INC.
- Current Assignee Address: CN TAOYUAN CITY
- Priority: CN201510282388.3 20150528
- Main IPC: H02M7/00
- IPC: H02M7/00 ; H05K7/20 ; H05K1/18
Abstract:
A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.
Public/Granted literature
- US10104813B2 Power circuit module Public/Granted day:2018-10-16
Information query
