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公开(公告)号:US20160352244A1
公开(公告)日:2016-12-01
申请号:US15165273
申请日:2016-05-26
Applicant: DELTA ELECTRONICS,INC.
Inventor: Wei CHENG , Shouyu HONG , Zhenqing ZHAO , Tao WANG
CPC classification number: H05K7/209 , H01L23/053 , H01L23/24 , H01L23/3735 , H01L23/4006 , H01L23/49811 , H01L2224/32225 , H01L2224/48139 , H01L2224/48227 , H01L2224/4846 , H01L2224/73265 , H05K1/0204 , H05K1/0209 , H05K1/0271 , H05K2201/066 , H05K2201/10053 , H05K2201/10166 , H05K2201/10409 , H05K2201/2018 , H01L2924/00
Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.
Abstract translation: 提供电源电路模块。 封装电源电路模块包括:压板,包括突出体; 一个框架; 以及承载电源电路的基板,所述电力电路至少包括电力开关装置; 框架设置在基板和压板之间,框架支撑压板,并且由基板,压板和框架形成基本封闭的空间; 并且当在压板上施加外力时,突出体压靠基板并与基板绝缘接触,并且外力均匀地在基板上传递。
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公开(公告)号:US20190304882A1
公开(公告)日:2019-10-03
申请号:US16258747
申请日:2019-01-28
Applicant: Delta Electronics,Inc.
Inventor: Shouyu HONG , Haibin XU , Wei CHENG , Tao WANG , Zhenqing ZHAO
IPC: H01L23/495 , H01L21/48
Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.
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