公开(公告)号：US20190304882A1

公开(公告)日：2019-10-03

申请号：US16258747

申请日：2019-01-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Haibin XU ,  Wei CHENG ,  Tao WANG ,  Zhenqing ZHAO

IPC: H01L23/495 ,  H01L21/48

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

公开(公告)号：US20160118177A1

公开(公告)日：2016-04-28

申请号：US14879263

申请日：2015-10-09

Applicant: DELTA ELECTRONICS, INC.

Inventor： Haibin XU ,  Tao WANG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Yicong XIE ,  Zengsheng WANG

IPC: H01F27/24 ,  H01F27/28 ,  H01F41/02

CPC classification number: H01F3/14 ,  H01F27/2804

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

Abstract translation: 提供了磁芯部件及其间隙控制方法。 磁芯部件包括第一磁性部件，第二磁性部件和设置在它们之间的第一间隙控制结构。 第一间隙控制结构包括触变材料并施加在第一磁性部件上并固化，第二磁性部件设置在固化的第一间隙控制结构上，第一磁性部件和第二磁性部件之间的间隙由 第一间隙控制结构的有效高度。 间隙控制结构在固化后具有最小的可变性，并且其有效高度可以始终保持在所需的间隙高度。

公开(公告)号：US20170012030A1

公开(公告)日：2017-01-12

申请号：US15151730

申请日：2016-05-11

Applicant: DELTA ELECTRONICS,INC.

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Zeng LI ,  Kai LU

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07

CPC classification number: H01L25/162 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/12035 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13023 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.

Abstract translation: 本公开提供了一种至少具有集成控制电路的功率模块，包括：功率基板; 安装在电源基板上的电源装置; 并且至少一个支撑所述控制电路的控制基板与所述电力基板电连接并且以与所述电力设备安装在所述电力基板上的倾斜角成角度地配置; 其中所述倾斜角度大于或等于45度且小于或等于135度。 在本公开提供的功率模块中，仅功率基板以及控制基板与功率基板之间的连接占据功率模块的覆盖区域，因此有效地减小了功率模块的水平占用面积， 从而增加了功率模块的功率密度。

公开(公告)号：US20180358157A1

公开(公告)日：2018-12-13

申请号：US16104961

申请日：2018-08-20

Applicant: Delta Electronics,Inc.

Inventor： Haibin XU ,  Tao WANG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Yicong XIE ,  Zengsheng WANG

IPC: H01F3/14 ,  H01F27/28

CPC classification number: H01F3/14 ,  H01F27/2804

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

公开(公告)号：US20160352247A1

公开(公告)日：2016-12-01

申请号：US15168235

申请日：2016-05-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Zeng LI ,  Jun-Cheng LU ,  Tao WANG ,  Zheng-Fen WAN ,  Zhen-Qing ZHAO

IPC: H02M7/00 ,  H01L25/18 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/07

CPC classification number: H02M7/003 ,  H01L21/4846 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/2743 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.

Abstract translation: 功率模块封装结构包括第一导电层，第一绝缘层，第二导电层，第一功率器件和第一控制器件。 第一绝缘层设置在第一导电层的上方。 第二导电层设置在第一绝缘层的上方。 第一功率器件设置在第一导电层上。 第一控制装置设置在第二导电层上，用于控制第一电力装置。 第一导电层，第二导电层，第一功率器件和第一控制器件形成环路。 在环路中流过第一导电层的电流的方向与流过环路中的第二导电层的电流方向相反。

公开(公告)号：US20160352244A1

公开(公告)日：2016-12-01

申请号：US15165273

申请日：2016-05-26

Applicant: DELTA ELECTRONICS,INC.

Inventor： Wei CHENG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Tao WANG

IPC: H02M7/00 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K7/209 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0271 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.

Abstract translation: 提供电源电路模块。 封装电源电路模块包括：压板，包括突出体; 一个框架; 以及承载电源电路的基板，所述电力电路至少包括电力开关装置; 框架设置在基板和压板之间，框架支撑压板，并且由基板，压板和框架形成基本封闭的空间; 并且当在压板上施加外力时，突出体压靠基板并与基板绝缘接触，并且外力均匀地在基板上传递。

公开(公告)号：US20160381785A1

公开(公告)日：2016-12-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Tao WANG ,  Le LIANG

IPC: H05K1/02 ,  H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H05K1/11 ,  H01L23/495

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

Abstract translation: 一种成型型电力模块包括：引线框，包括第一步骤和第二步骤; 第一平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第一台阶; 以及第二平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第二台阶，其中，所述第一平面功率器件的第一表面和所述第一表面的第一表面 第二平面功率器件彼此面对，其垂直方向上的投影面积至少部分重叠，并且第一平面功率器件至少具有与第二平面功率器件的电极电连接的一个电极。

公开(公告)号：US20160254217A1

公开(公告)日：2016-09-01

申请号：US14918837

申请日：2015-10-21

Applicant: Delta Electronics, Inc.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Shouyu HONG ,  Tao WANG ,  Le LIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电源转换电路的封装模块可表面安装在系统板上。 功率转换电路的封装模块包括：基板，功率器件模具，模制层和多个引脚。 基板具有金属层，绝缘基板层和导热层。 绝缘基板层设置在金属层与导热层之间。 功率器件管芯耦合到金属层。 衬底的金属层上的器件嵌入成型层中。 多个引脚电耦合到金属层并且嵌入到模制层中，电耦合到系统板的每个引脚的至少接触表面被暴露，并且接触表面平行和/或垂直于 导热层。 具有这种结构的封装模块占地面积小，便于批量生产。

公开(公告)号：US20160113107A1

公开(公告)日：2016-04-21

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao WANG ,  Zhen-Qing ZHAO ,  Kai LU ,  Zheng-Fen WAN ,  Hai-Bin XU

IPC: H05K1/02

CPC classification number: H01L24/00 ,  H01L2224/32225 ,  H01L2224/33 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/2036 ,  Y02P70/613

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

Abstract translation: 本公开公开了一种电源模块。 功率模块包括基板，功率芯片，接合材料和至少一个间隔件。 衬底包括电路图案层。 功率芯片通过接合材料结合到电路图案层。 间隔物位于电路图案层和功率芯片之间，以便将功率芯片远离电路图案层远离。