发明申请
- 专利标题: ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES
- 专利标题(中): 用于电子设备的电子底座
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申请号: US15236255申请日: 2016-08-12
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公开(公告)号: US20160353616A1公开(公告)日: 2016-12-01
- 发明人: Richard Hung Minh Dinh , Shayan Malek , Scott A. Myers , Ronald W. Dimpflmaier
- 申请人: Apple Inc.
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; H05K1/02 ; H05K3/34 ; H01L23/552 ; H01L23/29 ; H01M2/02 ; H01L23/373 ; H01L23/66 ; H03F3/195 ; H03F3/213 ; G06F1/16 ; H05K1/18 ; H01L23/24
摘要:
Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
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