发明申请
US20160358871A1 Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
审中-公开
滤波器和电容器使用再分配层和微凹凸层
- 专利标题： Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- 专利标题（中）： 滤波器和电容器使用再分配层和微凹凸层
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申请号： US15238520申请日： 2016-08-16
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公开(公告)号： US20160358871A1公开(公告)日： 2016-12-08
- 发明人: Hsiao-Tsung Yen , Jhe-Ching Lu , Yu-Ling Lin , Chin-Wei Kuo , Min-Chie Jeng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/00 ; H01L25/18
摘要：
An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.
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