A solar cell includes a silicon substrate having a transparent conductive oxide (TCO) film formed on a surface thereof, a dielectric mask having openings formed on a surface of the TCO film, a seed layer formed in the openings of the dielectric mask, and a copper plating later formed on the seed layer. In a method of forming a solar cell, a TCO film is applied to a surface of a silicon substrate, a dielectric mask is formed on a surface of the TCO film, a metal seed layer is applied to openings in the dielectric mask by in-situ hydrogen plasma treatment, and copper metal is plated onto the metal seed layer via light induced plating or field induced plating to form a copper electrode. The solar cell may then be annealed to form an indium-copper alloy which improves adhesion of the copper electrode.