Invention Application
- Patent Title: Self Directed Metrology and Pattern Classification
- Patent Title (中): 自导计量和模式分类
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Application No.: US15247774Application Date: 2016-08-25
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Publication No.: US20160372303A1Publication Date: 2016-12-22
- Inventor: Allen Park , Ajay Gupta , Jan Lauber
- Applicant: KLA-Tencor Corporation
- Main IPC: H01J37/22
- IPC: H01J37/22 ; G06K9/62 ; G06T7/00

Abstract:
Methods and systems for determining parameter(s) of a process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for determining an area of a defect detected on a specimen. The computer subsystem(s) are also configured for correlating the area of the defect with information for a design for the specimen and determining a spatial relationship between the area of the defect and the information for the design based on results of the correlating. In addition, the computer subsystem(s) are configured for automatically generating a region of interest to be measured during a process performed for the specimen with a measurement subsystem based on the spatial relationship.
Public/Granted literature
- US10483081B2 Self directed metrology and pattern classification Public/Granted day:2019-11-19
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