发明申请
- 专利标题： PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US15142484申请日： 2016-04-29
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公开(公告)号： US20160381791A1公开(公告)日： 2016-12-29
- 发明人: Han KIM , Sang Yul HA , Sung Han KIM , Kyung Ho LEE , Seok Hwan AHN , Myung Sam KANG
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2015-0092258 20150629; KR10-2015-0127220 20150908
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/46 ; H05K1/11
摘要：
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer
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