公开(公告)号：US20230209161A1

公开(公告)日：2023-06-29

申请号：US17989832

申请日：2022-11-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Yeon HWANG ,  Yeo Ok JEON ,  Seok Hwan KIM ,  Seung Jae SONG ,  Han KIM

IPC: H04N5/225 ,  H04M1/02

CPC classification number: H04N23/54 ,  H04M1/0264 ,  H04M2250/52

Abstract: A camera module is provided. The camera module includes a lens barrel in which at least one lens is installed; and a lens holder to which the lens barrel is fixedly installed, wherein one of the lens holder and the lens barrel is provided with a coupling protrusion, and the other thereof is provided with a coupling groove into which the coupling protrusion is inserted, the lens holder is provided with a support portion that supports one end portion of the lens barrel, wherein the one end portion of the lens barrel is disposed between the coupling protrusion and the support portion, and the support portion of the lens holder elastically supports the lens barrel in an optical axis direction.

公开(公告)号：US20210203815A1

公开(公告)日：2021-07-01

申请号：US17071366

申请日：2020-10-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Han KIM ,  Han KIM ,  Young Bok YOON ,  Seok Hwan KIM ,  Tae Ho YUN ,  Kyung Ho LEE ,  Jong Gil WON ,  Chul Kyu KIM ,  Jong Man KIM

IPC: H04N5/225 ,  G03B17/02 ,  H05K5/02 ,  H05K5/03

Abstract: An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

公开(公告)号：US20190043835A1

公开(公告)日：2019-02-07

申请号：US15966673

申请日：2018-04-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae LEE ,  Han KIM ,  Hyung Joon KIM

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/95 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A connection system of semiconductor packages includes: a printed circuit board having a first surface, and a second surface, opposing the first surface; a first semiconductor package disposed on the first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; and a second semiconductor package disposed on the second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures. The first semiconductor package includes an application processor (AP) and a power management integrated circuit (PMIC) disposed side by side, and the second semiconductor package includes a memory.

公开(公告)号：US20180012696A1

公开(公告)日：2018-01-11

申请号：US15472010

申请日：2017-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Su Bong JANG ,  Min Ki JUNG ,  Han KIM

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F41/043 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0073

Abstract: A coil component includes a body including a plurality of first and second coil patterns, which are alternately disposed, and insulating layers disposed therebetween. The first coil patterns may be connected to the second coil patterns adjacent to the first coil patterns by vias, a plurality of coils including at least one each of the first and second coil patterns may be formed, and the plurality of coils may be connected in parallel to each other.

公开(公告)号：US20170330814A1

公开(公告)日：2017-11-16

申请号：US15667738

申请日：2017-08-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung On KANG ,  Woo Sung HAN ,  Young Gwan KO ,  Chul Kyu KIM ,  Han KIM

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L23/522 ,  H01L21/48

CPC classification number: H01L23/3128 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/16 ,  H01L23/295 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/145 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

公开(公告)号：US20170162527A1

公开(公告)日：2017-06-08

申请号：US15203006

申请日：2016-07-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Young Gwan KO ,  Kang Heon HUR ,  Kyung Moon JUNG ,  Sung Han KIM

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/528 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L23/481 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/12105 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1815 ,  H01L2924/186 ,  H01L2924/2064 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121

Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.

公开(公告)号：US20170055345A1

公开(公告)日：2017-02-23

申请号：US15084864

申请日：2016-03-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Han KIM ,  Han KIM ,  Mi-Sun HWANG ,  Sang-Yul HA ,  Seok-Hwan AHN ,  Kyung-Ho LEE

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K3/0017 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/2009

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘基板，设置在绝缘基板上的电路，在绝缘基板上空间分离的一对第一加强件，平行于绝缘基板的表面延伸的第一加强件，以及第二加强件， 一对第一加强。

公开(公告)号：US20170004921A1

公开(公告)日：2017-01-05

申请号：US15200371

申请日：2016-07-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chul Kyu KIM ,  Han KIM ,  Kyung Hyun PARK ,  Ki Won CHANG ,  Jung Wook SEO ,  Jae Suk SUNG

IPC: H01F38/14 ,  H02J5/00 ,  H02J7/02 ,  H01Q7/06 ,  H01F27/22

CPC classification number: H02J50/10 ,  H01F27/22 ,  H01F38/14 ,  H01F2038/143

Abstract: A coil device comprises a first coil, a second coil, a first conductor, and a first film. The second coil is disposed inside an inner boundary line of the first coil. The first conductor is disposed between the inner boundary line of the first coil and an outer boundary line of the second coil to dissipate heat. The first film is disposed on upper surfaces of the first coil, the second coil, and the first conductor.

Abstract translation: 线圈装置包括第一线圈，第二线圈，第一导体和第一薄膜。 第二线圈设置在第一线圈的内边界线的内侧。 第一导体设置在第一线圈的内边界线和第二线圈的外边界线之间以散热。 第一膜设置在第一线圈，第二线圈和第一导体的上表面上。

公开(公告)号：US20160302301A1

公开(公告)日：2016-10-13

申请号：US15002028

申请日：2016-01-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Han KIM ,  Dae Hyun PARK

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/0094 ,  H05K3/403 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09854

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes a base, a wiring structure disposed on at least one of a surface and an interior of the base, and a plurality of stitching vias penetrating through the base in a thickness direction along an edge of the base and having side surfaces exposed externally.

Abstract translation: 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括底座，设置在基座的表面和内部中的至少一个上的布线结构，以及沿着基座的边缘在厚度方向上穿过基座的多个缝合通孔，并且具有侧表面 外露。

公开(公告)号：US20230343515A1

公开(公告)日：2023-10-26

申请号：US17884759

申请日：2022-08-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Han KIM ,  Min Cheol PARK ,  Su Bong JANG

IPC: H01G4/01 ,  H01G4/008 ,  H01G4/248

CPC classification number: H01G4/01 ,  H01G4/008 ,  H01G4/248

Abstract: A capacitor component includes a body including a capacitance formation portion including a plurality of unit devices including a first internal electrode, a first dielectric film surrounding the first internal electrode, and a second internal electrode surrounding the first dielectric film, and a molded portion surrounding the capacitance formation portion, first and second external electrodes respectively disposed on a first surface and a second surface of the body opposing each other in a first direction to be respectively connected to the first and second internal electrodes. Cross-sections perpendicular to the first direction of at least two of the plurality of unit devices have a polygonal shape.