公开(公告)号：US20240213509A1

公开(公告)日：2024-06-27

申请号：US18204534

申请日：2023-06-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han KIM ,  Jong Ho CHUNG ,  Jung Ho SHIM ,  Jae Hyuk JANG ,  Bon Seok KOO ,  Hong Ryul LEE

IPC: H01M8/1233 ,  H01M8/0273 ,  H01M8/04007 ,  H01M8/2432 ,  H01M8/2484

CPC classification number: H01M8/1233 ,  H01M8/0273 ,  H01M8/04067 ,  H01M8/2432 ,  H01M8/2484 ,  H01M2008/1293

Abstract: A solid oxide cell stack includes a first end plate having a flow path, a solid oxide cell disposed on the first end plate, and a second end plate including a lower region disposed on the solid oxide cell and having a first through-hole, and an upper region disposed on the lower region and having a second through-hole. In the second end plate, an inner sidewall of the upper region forming the second through-hole is inclined such that a width of the second through-hole increases in an upward direction.

公开(公告)号：US20180047683A1

公开(公告)日：2018-02-15

申请号：US15679860

申请日：2017-08-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae LEE ,  Sung Han KIM ,  Han KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/02 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from the semiconductor chip; a second connection member disposed on the first connection member, the dummy chip, and the active surface of the semiconductor chip; and an encapsulant encapsulating at least portions of the first connection member, the dummy chip, and the inactive surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads.

公开(公告)号：US20180233432A1

公开(公告)日：2018-08-16

申请号：US15955178

申请日：2018-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Young Gwan KO ,  Kang Heon HUR ,  Kyung Moon JUNG ,  Sung Han KIM

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.

公开(公告)号：US20170077525A1

公开(公告)日：2017-03-16

申请号：US15341460

申请日：2016-11-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han KIM ,  Jong Ho CHUNG ,  Jong Sik YOON ,  Bon Seok KOO

IPC: H01M8/0228 ,  H01M8/0206 ,  C04B37/02 ,  H01M8/0215

CPC classification number: H01M8/0228 ,  C04B37/021 ,  C04B2237/066 ,  C04B2237/068 ,  C04B2237/62 ,  C04B2237/68 ,  H01M8/0206 ,  H01M8/0215 ,  H01M2008/1293 ,  Y02E60/50 ,  Y02E60/525 ,  Y02P70/56

Abstract: Disclosed herein are an interconnect for a solid oxide fuel cell and a method for manufacturing the same, the interconnect including: a conductive core; an oxidation-resistant insulating part receiving therein; and an oxidation-resistant conductive material layer coated on an exposed surface of the conductive core, which is exposed to an external environment by removing a portion of the oxidation-resistant insulating part, so that the interconnect can maintain durability against high-temperature heat generated from a flat type solid oxide fuel cell for a long time and thus have a very small voltage loss due to oxidation even with the use over a long-time period; have no sealing problem and no delaminating problem of a coating film due to a difference in coefficient of thermal expansion; be inexpensive; and have a simple structure.

Abstract translation: 本文公开了一种固体氧化物燃料电池的互连及其制造方法，所述互连包括：导电芯; 接收其中的抗氧化绝缘部件; 以及通过除去一部分耐氧化绝缘部分而暴露在外部环境中的涂覆在导电芯的暴露表面上的抗氧化导电材料层，使得互连可以保持对产生的高温热的耐久性 从扁平型固体氧化物燃料电池长时间，即使长时间使用也因氧化而具有非常小的电压损失; 由于热膨胀系数的差异，没有涂膜的密封问题和涂膜的脱层问题; 价格便宜 并具有简单的结构。

公开(公告)号：US20160381791A1

公开(公告)日：2016-12-29

申请号：US15142484

申请日：2016-04-29

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Han KIM ,  Sang Yul HA ,  Sung Han KIM ,  Kyung Ho LEE ,  Seok Hwan AHN ,  Myung Sam KANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4688 ,  H05K1/0271 ,  H05K1/053 ,  H05K1/115 ,  H05K3/0023 ,  H05K3/1258

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括内层，该内层至少包括一层绝缘层和布线部分，外层设置在内层的相对侧，外层包括增强层和布线部分，该加强层的刚度大于 绝缘层

公开(公告)号：US20210203815A1

公开(公告)日：2021-07-01

申请号：US17071366

申请日：2020-10-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Han KIM ,  Han KIM ,  Young Bok YOON ,  Seok Hwan KIM ,  Tae Ho YUN ,  Kyung Ho LEE ,  Jong Gil WON ,  Chul Kyu KIM ,  Jong Man KIM

IPC: H04N5/225 ,  G03B17/02 ,  H05K5/02 ,  H05K5/03

Abstract: An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

公开(公告)号：US20200090848A1

公开(公告)日：2020-03-19

申请号：US16693960

申请日：2019-11-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sa Yong LEE ,  Yong Il KWON ,  Jin Ho HONG ,  Sung Han KIM ,  Keun Yong LEE

IPC: H01F17/00

Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

公开(公告)号：US20170162527A1

公开(公告)日：2017-06-08

申请号：US15203006

申请日：2016-07-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Young Gwan KO ,  Kang Heon HUR ,  Kyung Moon JUNG ,  Sung Han KIM

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/528 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L23/481 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/12105 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1815 ,  H01L2924/186 ,  H01L2924/2064 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121

Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.

公开(公告)号：US20140234751A1

公开(公告)日：2014-08-21

申请号：US13892060

申请日：2013-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Ho CHUNG ,  Sung Han KIM ,  Jong Sik YOON ,  Bon Seok KOO

IPC: H01M8/02 ,  H01M8/10

CPC classification number: H01M8/0273 ,  H01M8/1213 ,  H01M8/2425 ,  H01M2008/1293 ,  Y02P70/56

Abstract: There are provided a solid oxide fuel cell capable of firmly sealing an anode while simultaneously securing rigidity of an anode support structure, and a manufacturing method thereof. The solid oxide fuel cell includes an electrolyte layer, a cathode provided on one surface of the electrolyte layer, an anode provided on the other surface of the electrolyte layer, and at least one reinforcing member disposed within the anode to reinforce rigidity thereof.

Abstract translation: 提供一种能够牢固地密封阳极同时确保阳极支撑结构的刚性的固体氧化物燃料电池及其制造方法。 所述固体氧化物型燃料电池包括电解质层，设置在所述电解质层的一个表面上的阴极，设置在所述电解质层的另一个表面上的阳极，以及设置在所述阳极内的至少一个加强构件，以增强其刚性。

公开(公告)号：US20230180610A1

公开(公告)日：2023-06-08

申请号：US17741352

申请日：2022-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han KIM ,  Se Yeon HWANG ,  Joon Woo GI ,  Jong Ho CHUNG ,  Han KIM

IPC: H01L35/32 ,  H01L35/34 ,  H01L35/22

CPC classification number: H01L35/32 ,  H01L35/34 ,  H01L35/22

Abstract: A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.