Invention Application
- Patent Title: METHOD FOR HEALING DEFECT OF CONDUCTIVE LAYER, METHOD FOR FORMING METAL-CARBON COMPOUND LAYER, 2D NANO MATERIALS, TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 导电层的缺陷方法,形成金属碳化合物层的方法,二维纳米材料,透明电极及其制造方法
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Application No.: US15196820Application Date: 2016-06-29
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Publication No.: US20170004899A1Publication Date: 2017-01-05
- Inventor: TAEYOON LEE , JONG HYUN AHN , Juree HONG , Jae-Bok LEE , Han-Bo-Ram LEE
- Applicant: Industry-Academic Cooperation Foundation, Yonsei University , Incheon University Industry Academic Cooperation Foundation
- Priority: KR10-2015-0092699 20150630
- Main IPC: H01B1/04
- IPC: H01B1/04 ; H01B13/00

Abstract:
Provided are method for healing defect of conductive layer, method for forming metal-carbon compound layer, 2D nano materials, and transparent electrode and method for manufacturing the same. According to an embodiment of present invention, the method for healing defect of conductive layer comprises: forming a conductive layer on a first metal substrate; contacting the first metal substrate with a salt solution containing a second metal in an ionic form, and forming a second metal particle at least in a portion of a conductive area, the second metal having greater reduction potential than a first metal.
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