Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGES
- Patent Title (中): 半导体器件封装
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Application No.: US14791043Application Date: 2015-07-02
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Publication No.: US20170005042A1Publication Date: 2017-01-05
- Inventor: Shih-Ren CHEN , Cheng-Nan LIN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW KAOHSIUNG
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW KAOHSIUNG
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/56

Abstract:
The present disclosure relates to a semiconductor device package and a method for manufacturing the semiconductor device package. The semiconductor device package includes a substrate, a grounding element, a component, a package body and a conductive layer. The grounding element is disposed in the substrate and includes a connection surface exposed at a second portion of a lateral surface of the substrate. The component is disposed on a top surface of the substrate. The package body covers the component and the top surface of the substrate. A lateral surface of the package body is aligned with the lateral surface of the substrate. The conductive layer covers a top surface and the lateral surface of the package body, and further covers the second portion of the lateral surface of the substrate. A first portion of the lateral surface of the substrate is exposed from the conductive layer.
Public/Granted literature
- US09653407B2 Semiconductor device packages Public/Granted day:2017-05-16
Information query
IPC分类: