Invention Application
US20170005704A1 TRANSMITTING MAGNETIC FIELD THROUGH METAL CHASSIS USING FRACTAL SURFACES
审中-公开
通过使用分形表面的金属底板传输磁场
- Patent Title: TRANSMITTING MAGNETIC FIELD THROUGH METAL CHASSIS USING FRACTAL SURFACES
- Patent Title (中): 通过使用分形表面的金属底板传输磁场
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Application No.: US15264524Application Date: 2016-09-13
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Publication No.: US20170005704A1Publication Date: 2017-01-05
- Inventor: Anand S. Konanur , Ulun Karacaoglu , Songnan Yang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01Q1/50 ; H01Q1/52 ; H01Q1/22 ; H01Q1/36

Abstract:
Described herein are techniques related one or more systems, apparatuses, methods, etc. for reducing induced currents in a apparatus chassis. For example, a fractal slot is constructed in the apparatus chassis to reduce the induced currents, and enhance passage of magnetic fields through the apparatus chassis. In this example, the fractal slot may include a no-self loop fractal space filling curve shape to provide high impedance to the induced currents.
Public/Granted literature
- US09853695B2 Transmitting magnetic field through metal chassis using fractal surfaces Public/Granted day:2017-12-26
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