发明申请
- 专利标题： Method of Forming a Flexible Semiconductor Layer and Devices on a Flexible Carrier
- 专利标题（中）： 在柔性载体上形成柔性半导体层和器件的方法
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申请号： US15146155申请日： 2016-05-04
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公开(公告)号： US20170011947A1公开(公告)日： 2017-01-12
- 发明人: Stephen W. Bedell , Devendra K. Sadana , Katherine L. Saenger , Abdelmajid Salhi
- 申请人： International Business Machines Corporation
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01L21/3213 ; H01L21/027 ; H01L23/528 ; H01L29/04 ; H01L21/768 ; H01L21/285
摘要：
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a semiconductor substrate; forming an interfacial release layer on an exposed second surface of the semiconductor substrate; adhesively bonding the interfacial release layer to a rigid handle substrate using an epoxy; removing at least a portion of the stressor layer stack from the first surface of the semiconductor substrate; processing the semiconductor substrate; and removing the semiconductor substrate from the interfacial release layer to impart flexibility to the semiconductor substrate.
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