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Invention Application
US20170014969A1 METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE 审中-公开
用于处理电介质基板的方法和组合物

  • Patent Title: METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
  • Patent Title (中): 用于处理电介质基板的方法和组合物
  • Application No.: US15207973
    Application Date: 2016-07-12
  • Publication No.: US20170014969A1
    Publication Date: 2017-01-19
  • Inventor: Viet LAM , Ji CUI
  • Applicant: Cabot Microelectronics Corporation
  • Main IPC: B24B37/04
  • IPC: B24B37/04 ;  C09G1/02
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
Abstract:
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka “slurry”) and an abrasive pad, e.g., CMP processing.
Abstract(Chinese):

描述了使用抛光组合物（又称“浆料”）和研磨垫（例如CMP处理）来处理（抛光或平面化）包含图形电介质材料的基板的材料和方法。

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