Invention Application
- Patent Title: Sputtering Target, Method For Manufacturing Sputtering Target, And Method For Forming Thin Film
- Patent Title (中): 溅射靶,制造溅射靶的方法和形成薄膜的方法
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Application No.: US15189104Application Date: 2016-06-22
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Publication No.: US20170016108A1Publication Date: 2017-01-19
- Inventor: Shunpei YAMAZAKI , Tetsunori MARUYAMA , Yuki IMOTO , Hitomi SATO , Masahiro WATANABE , Mitsuo MASHIYAMA , Kenichi OKAZAKI , Motoki NAKASHIMA , Takashi SHIMAZU
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Priority: JP2011-128750 20110608; JP2011-274954 20111215
- Main IPC: C23C14/08
- IPC: C23C14/08 ; H01L29/24 ; H01L29/66 ; H01L29/786 ; C23C14/34 ; H01L21/02

Abstract:
There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
Public/Granted literature
- US10889888B2 Sputtering target, method for manufacturing sputtering target, and method for forming thin film Public/Granted day:2021-01-12
Information query
IPC分类: