Invention Application
US20170016108A1 Sputtering Target, Method For Manufacturing Sputtering Target, And Method For Forming Thin Film 审中-公开
溅射靶,制造溅射靶的方法和形成薄膜的方法

Sputtering Target, Method For Manufacturing Sputtering Target, And Method For Forming Thin Film
Abstract:
There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
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