Invention Application
- Patent Title: Simulation of Hierarchical Circuit Element Arrays
- Patent Title (中): 分层电路元件阵列的仿真
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Application No.: US14806566Application Date: 2015-07-22
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Publication No.: US20170024502A1Publication Date: 2017-01-26
- Inventor: Srinivas Jallepalli , Jon S. Choy
- Applicant: Freescale Semiconductor, Inc.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
This disclosure describes a design tool that iteratively performs simulation sets on an integrated circuit design, each corresponding to a different hierarchical level with each of the simulation sets producing a different set of simulation results. Each of the simulation sets utilizes a different set of local parameter values that include extreme instance local parameter values based on the set of simulation results of a preceding simulation set. The design tool generates a set of hierarchically aggregated simulation results based upon the last set of simulation results and global parameters, and modifies the integrated circuit design based upon a yield estimation that is determined from comparing the set of hierarchically aggregated simulation results to specification requirements that correspond to the integrated circuit design.
Public/Granted literature
- US09940418B2 Simulation of hierarchical circuit element arrays Public/Granted day:2018-04-10
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