Invention Application
- Patent Title: DIE-DIE STACKING
- Patent Title (中): DIE-DIE堆叠
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Application No.: US14803466Application Date: 2015-07-20
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Publication No.: US20170025398A1Publication Date: 2017-01-26
- Inventor: Sven Beyer , Jan Hoentschel , Alexander Ebermann
- Applicant: GLOBALFOUNDRIES Inc.
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/00 ; H01L21/768 ; H01L23/48

Abstract:
A semiconductor die is provided with an optical transmitter configured to transmit an optical signal to another die and an optical receiver configured to receive an optical signal from another die. Furthermore, a method of forming a semiconductor device is provided including forming a first semiconductor die with the steps of providing a semiconductor substrate, forming a transistor device at least partially over the semiconductor substrate, forming an optical receiver one of at least partially over and at least partially in the semiconductor substrate, forming a metallization layer over the transistor device, and forming an optical transmitter one of at least partially over the metallization layer and at least partially in the metallization layer.
Public/Granted literature
- US09806067B2 Die-die stacking Public/Granted day:2017-10-31
Information query
IPC分类: