Invention Application
- Patent Title: PAIN-RELATED COMPOUND AND MEDICAL COMPOSITION
- Patent Title (中): 与PAIN相关的化合物和医药组合物
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Application No.: US15105985Application Date: 2014-12-18
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Publication No.: US20170029389A1Publication Date: 2017-02-02
- Inventor: Masatoshi HAGIWARA , Masayasu TOYOMOTO , Takamitsu HOSOYA , Suguru YOSHIDA , Takashi KURIHARA
- Applicant: KYOTO UNIVERSITY , NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERSITY , KAGOSHIMA UNIVERSITY
- Applicant Address: JP Kyoto-shi, Kyoto JP Bunkyo-ku, Tokyo JP Kagoshima-shi, Kagoshima
- Assignee: KYOTO UNIVERSITY,NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERSITY,KAGOSHIMA UNIVERSITY
- Current Assignee: KYOTO UNIVERSITY,NATIONAL UNIVERSITY CORPORATION TOKYO MEDICAL AND DENTAL UNIVERSITY,KAGOSHIMA UNIVERSITY
- Current Assignee Address: JP Kyoto-shi, Kyoto JP Bunkyo-ku, Tokyo JP Kagoshima-shi, Kagoshima
- Priority: JP2013-261396 20131218
- International Application: PCT/JP2014/083569 WO 20141218
- Main IPC: C07D277/64
- IPC: C07D277/64
Abstract:
Provided is a pain-related compound, a pain-related pharmaceutical composition, and use of the same. Provided in one or more embodiments is a compound represented by Formula (I), a prodrug of the same, or a pharmaceutically permissible salt of any of the same.
Public/Granted literature
- US09745275B2 Pain-related compound and medical composition Public/Granted day:2017-08-29
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