Invention Application
- Patent Title: Camera Module
- Patent Title (中): 相机模块
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Application No.: US15221720Application Date: 2016-07-28
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Publication No.: US20170029596A1Publication Date: 2017-02-02
- Inventor: Young Shin Kim , Kevin A. McCullough , Xinyu Zhao
- Applicant: Ticona LLC
- Main IPC: C08K3/38
- IPC: C08K3/38 ; H04N5/225 ; G03B17/55 ; C09K5/14 ; C08K3/32
Abstract:
A camera module that comprises a molded part is provided. The molded part includes a polymer composition that has an in-plane thermal conductivity of about 2.0 W/m-K or more. The polymer composition includes an aromatic polymer and a thermally conductive particulate material.
Public/Granted literature
- US09862809B2 Camera module Public/Granted day:2018-01-09
Information query
