Invention Application
US20170029668A1 FARNESENE-BASED TACKIFYING RESINS AND ADHESIVE COMPOSITIONS CONTAINING THE SAME
审中-公开
基于芳香族的树脂和含有它们的粘合剂组合物
- Patent Title: FARNESENE-BASED TACKIFYING RESINS AND ADHESIVE COMPOSITIONS CONTAINING THE SAME
- Patent Title (中): 基于芳香族的树脂和含有它们的粘合剂组合物
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Application No.: US14815114Application Date: 2015-07-31
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Publication No.: US20170029668A1Publication Date: 2017-02-02
- Inventor: Keith A. Nelson , Anaïs Pierre-Justin , Nestor P. Hansen
- Applicant: Fina Technology, Inc.
- Applicant Address: US TX Houston
- Assignee: Fina Technology, Inc.
- Current Assignee: Fina Technology, Inc.
- Current Assignee Address: US TX Houston
- Main IPC: C09J11/08
- IPC: C09J11/08 ; C09J7/02 ; C08F236/22 ; C09J153/02 ; C09J9/00

Abstract:
A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics and has a softening point greater than or equal to 80 degrees Celsius. A method of making the farnesene-based polymer includes combining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel. The tackifying resin may be combined with an elastomer to form a hot melt adhesive composition.
Public/Granted literature
- US10072186B2 Farnesene-based tackifying resins and adhesive compositions containing the same Public/Granted day:2018-09-11
Information query
IPC分类: