Invention Application
- Patent Title: PLASMA TREATMENT APPARATUS
- Patent Title (中): 等离子体处理装置
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Application No.: US15163715Application Date: 2016-05-25
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Publication No.: US20170032988A1Publication Date: 2017-02-02
- Inventor: Myoung Soo PARK , Yoshihisa HIRANO , Jongwoo SUN , Sangrok OH
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2015-0107295 20150729
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/50 ; C23C16/455 ; H01J37/32
Abstract:
A plasma treatment apparatus including a chamber in which a plasma treatment process is to be performed; and a plasma protection layer on an inner surface of the chamber, wherein the inner surface of the chamber has a center-line average roughness of 0.5 μm or less.
Information query
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