Invention Application
- Patent Title: METHODS OF FORMING MATERIAL LAYER
- Patent Title (中): 形成材料层的方法
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Application No.: US15227089Application Date: 2016-08-03
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Publication No.: US20170040172A1Publication Date: 2017-02-09
- Inventor: Sun-min MOON , Youn-soo KIM , Han-jin LIM , Yong-jae LEE , Se-hoon OH , Hyun-jun KIM , Jin-sun LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0110234 20150804
- Main IPC: H01L21/28
- IPC: H01L21/28 ; C23C16/50 ; H01L29/40 ; C23C16/455

Abstract:
A method of forming a material layer includes providing a substrate into a reaction chamber, providing a source material onto a substrate, the source material being a precursor of a metal or semimetal having a ligand, providing an ether-based modifier on the substrate, purging an inside of the reaction chamber, and reacting a reaction material with the source material to form the material layer.
Public/Granted literature
- US10103026B2 Methods of forming material layer Public/Granted day:2018-10-16
Information query
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