Invention Application
US20170040172A1 METHODS OF FORMING MATERIAL LAYER 审中-公开
形成材料层的方法

METHODS OF FORMING MATERIAL LAYER
Abstract:
A method of forming a material layer includes providing a substrate into a reaction chamber, providing a source material onto a substrate, the source material being a precursor of a metal or semimetal having a ligand, providing an ether-based modifier on the substrate, purging an inside of the reaction chamber, and reacting a reaction material with the source material to form the material layer.
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