Invention Application
- Patent Title: SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
- Patent Title (中): 半导体器件及其制造方法和电子设备
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Application No.: US15215800Application Date: 2016-07-21
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Publication No.: US20170047266A1Publication Date: 2017-02-16
- Inventor: Takumi Ihara , Nobutaka Shimizu , Masamitsu Ikumo
- Applicant: Socionext Inc.
- Priority: JP2015-158794 20150811
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L23/552 ; H01L23/00 ; H01L21/48
Abstract:
A semiconductor device includes a substrate and a semiconductor element mounted on the top surface of the substrate. On the top surface of the substrate, one or more pads are disposed outside the mounted semiconductor element when seen in a plan view. Then, a protrusion is disposed on each of the pads. A heat sink is disposed above the semiconductor element and the protrusions, and then bonded to the substrate by an adhesive provided between the heat sink and the substrate. The adhesive is provided in such a manner as to be in contact with the protrusions on the substrate.
Public/Granted literature
- US10008432B2 Semiconductor device, manufacturing method thereof, and electronic apparatus Public/Granted day:2018-06-26
Information query
IPC分类:
